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Fiber Optics
iSFP - Intelligent Small Form-factor Pluggable V23848-M15-C756 Single Mode 1300 nm 35 km 2.125/1.0625 Gbit/s Fibre Channel 1.25 Gigabit Ethernet Transceiver with LCTM Connector
Preliminary Data Sheet Features * Small Form-factor Pluggable (SFP) MSA compliant transceiver1) * Fully SFF-8472 MSA compliant1) * Incorporating Intelligent - Digital Diagnostic Monitoring Interface - Internal calibration implementation * Advanced release mechanisms File: 1132 - Easy access, even in belly to belly applications - Wire handle release for simplicity * Color coded blue tab (single mode) * PCI height compliant * Excellent EMI performance - Common ground concept * RJ-45 style LCTM connector system * Single power supply (3.3 V) * Low power consumption File: 1133 * Small size for high channel density * UL-94 V-0 certified * ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7) * Compliant with FCC (Class B) and EN 55022 * For distances of up to 35 km * DFB laser, PIN photo diode * Class 1 FDA and IEC laser safety compliant * AC/AC Coupling according to MSA * Extended operating temperature range of -20C to 80C * SFP evaluation kit V23848-S5-V4 available upon request * Recommendation: Infineon Cage one-piece design V23838-S5-N1 for press fit and/or solderable or V23838-S5-N1-BB for belly to belly applications
1)
MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers.
For ordering information see next page. LCTM is a trademark of Lucent.
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Pin Configuration Ordering Information Part Number V23848-M15-C756 Extraction Method Wire handle
Pin Configuration
20 19 18 17 16 15 14 13 12 11
VEET TD- TD+ VEET VCCT VCCR VEER RD+ RD- VEER
1 2 3 4 5 6 7 8 9 10
VEET Tx Fault Tx Disable MOD-DEF(2) MOD-DEF(1) MOD-DEF(0) Rate Select LOS VEER VEER
Top of transceiver
Bottom of transceiver (as viewed through top of transceiver)
File: 1306
Figure 1
iSFP Transceiver Electrical Pad Layout
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Pin Configuration Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
1) 2) 3) 4) 5) 6) 7)
Name
Logic Level N/A LVTTL LVTTL LVTTL LVTTL N/A N/A LVTTL N/A N/A N/A LVPECL LVPECL N/A N/A N/A N/A LVPECL LVPECL N/A
Function Transmitter Ground1) Transmitter Fault Indication2) 8) Transmitter Disable3) Module Definition 24) 8) Module Definition 15) 8) Module Definition 06) 8) Not connected Loss Of Signal7) 8) Receiver Ground1) Receiver Ground1) Receiver Ground1) Inv. Received Data Out9) Received Data Out9) Receiver Ground1) Receiver Power Transmitter Power Transmitter Ground1) Transmit Data In10) Inv. Transmit Data In10) Transmitter Ground1)
VEET
Tx Fault Tx Disable MOD-DEF(2) MOD-DEF(1) MOD-DEF(0) Rate Select LOS
VEER VEER VEER
RD- RD+
VEER VCCR VCCT VEET
TD+ TD-
VEET
8) 9) 10)
Common transmitter and receiver ground within the module. A high signal indicates a laser fault of some kind and that laser is switched off. A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off. MOD-DEF(2) is the data line of two wire serial interface for serial ID. MOD-DEF(1) is the clock line of two wire serial interface for serial ID. MOD-DEF(0) is grounded by the module to indicate that the module is present. A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received optical power is below the worst case receiver sensitivity. Should be pulled up on host board to VCC by 4.7 - 10 kW. AC coupled inside the transceiver. Must be terminated with 100 W differential at the user SERDES. AC coupled and 100 W differential termination inside the transceiver.
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Description Description The Infineon Fibre Channel / Gigabit Ethernet single mode transceiver - part of Infineon iSFP family - is based on the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000 Base-LX (long wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI (Rev. 13) 100-SM-LC-L for 1.0625 Gbit/s, and 200-SM-LC-L for 2.125 Gbit/s. The appropriate fiber optic cable is 9 m single mode fiber with LCTM connector. Link Length as Defined by IEEE and Fibre Channel Standards Fiber Type min.1) at 1.0625 Gbit/s 9 m, SMF 50 m, 500 MHz*km 62.5 m, 200 MHz*km at 1.25 Gbit/s 9 m, SMF 50 m, 400/500 MHz*km 62.5 m, 500 MHz*km at 2.125 Gbit/s 9 m, SMF 50 m, 500 MHz*km 62.5 m, 200 MHz*km
1)
Reach typ. max.2) 35,000 550 550 5,000 550 550 35,000 300 150
Unit
2 0.5 0.5 2 2 2 2 0.5 0.5
meters
meters
meters
2)
Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is supported. Longer reach possible depending upon link implementation.
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Description The Infineon iSFP single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LCTM receptacle. This transceiver supports the LCTM connectorization concept. It is compatible with RJ-45 style backpanels for high end datacom and telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 2.125, 1.0625 and 1.25 Gbit/s from a single power supply (+3.3 V). The 100 W differential data inputs and outputs are LVPECL and CML compatible. Functional Description of iSFP Transceiver This transceiver is designed to transmit serial data via single mode cable.
Tx Fault Automatic Shut-Down Tx Disable Tx Coupling Unit TD+ TD- Laser Driver e/o Laser
Power Control Monitor
o/e Single Mode Fiber Rx Coupling Unit
RD+ RD- LOS MOD-DEF(2) MOD-DEF(1) Digital Diagnostic Monitoring Interface EEPROM Limiting Amp TIA o/e
Alarm and Warning Flags
File: 1354
Figure 2
Functional Diagram
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Description The receiver component converts the optical serial data into LVPECL compatible electrical data (RD+ and RD-). The Loss Of Signal (LOS) shows whether an optical signal is present. The transmitter converts LVPECL compatible electrical serial data (TD+ and TD-) into optical serial data. Data lines are differentially 100 W terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high or not connected the transmitter is disabled. An enhanced Digital Diagnostic Monitoring Interface (Intelligent) has been incorporated into the Infineon Small Form-factor Pluggable (SFP) transceiver. This allows real time access to transceiver operating parameters, based on the SFF-8472. This transceiver features Internal Calibration. Measurements are calibrated over operating temperature and voltage and must be interpreted as defined in SFF-8472. The transceiver generates this diagnostic data by digitization of internal analog signals monitored by a new diagnostic Integrated Circuit (IC). This diagnostic IC has inbuilt sensors to include alarm and warning thresholds. These threshold values are set during device manufacture and therefore allow the user to determine when a particular value is outside of its operating range. Alarm and Warning Flags are given. Alarm Flags indicate conditions likely to be associated with an inoperational link and cause for immediate action. Warning Flags indicate conditions outside the normally guaranteed bounds but not necessarily causes of immediate link failures. These enhanced features are in addition to the existing SFP features provided by the manufacturer i.e. serial number and other vendor specific data. The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a 2 wire, serial interface at the 8 bit address 1010000X (A0h). The Digital Diagnostic Monitoring Interface makes use of the 8 bit address 1010001X (A2h), so the originally defined serial ID memory map remains unchanged and is therefore backward compatible.
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Description Digital Diagnostic Monitoring Parameters Parameter Tx Optical Power Rx Optical Power Bias Current Power Supply Voltage Transceiver Temperature Accuracy SFF-8472 Accuracy Actual
3 dB 3 dB 10% 3% 3C
1 dB 3 dB 10% 3% 3C
Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-B (MIL-STD 883D method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1C
Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz
EN 61000-4-3 IEC 61000-4-3
FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22
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Technical Data Technical Data Absolute Maximum Ratings Parameter Data Input Voltage Differential Data Input Voltage Swing Storage Ambient Temperature Operating Case Temperature1) Storage Relative Humidity Operating Relative Humidity Supply Voltage Data Output Current Receiver Optical Input Power
1)
Symbol
Limit Values min. max.
Unit V V C C % % V mA dBm
VID max VIDpk-pk TS TA
RHs RHo
VCC+0.5
5 -40 -40 5 5 85 85 95 85 4 50 3
VCC max Idata
RxP max
Operating case temperature measured at transceiver hottest point.
Exceeding any one of these values may permanently destroy the device.
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Technical Data Electrical Characteristics Parameter Common Supply Voltage In-rush Current1) Power Dissipation Transmitter Differential Data Input Voltage Swing2) Tx Disable Voltage Tx Enable Voltage Tx Fault High Voltage Tx Fault Low Voltage Reset Threshold 3) Reset Time Out 3) Supply Current4) Receiver Differential Data Output Voltage VODpk-pk 370 Swing 5) LOS Active LOS Normal Receiver 3 dB Cut-off Frequency6) Receiver 10 dB Cut-off Frequency6) Rise Time7) Fall Time7) Supply Current 4)
1)
Symbol min.
Limit Values typ. 3.3 max. 3.63 30 1 500 2 3200
Unit
VCC-VEE IIR max P VIDpk-pk
TxDis TxEn TxFH TxFL
2.97
V mA W mV V V V V V ms mA mV V V GHz GHz ps ps mVpp mA
VCC
0.8
VEE
2.4
VCC
0.5 2.75 240 80 900 2.85 300 150 2000
VEE
2.5 140
VTH tRES ITx
LOSA LOSN
2.4
VCC
0.5 1.5 3
VEE
tR-Rx tF-Rx
100 100
9)
t.b.d. t.b.d. 130
Power Supply Noise Rejection8) PSNR
IRx
2) 3) 4)
Measured with MSA recommended supply filter network (Figure 6). Maximum value above that of the steady state value. Internally AC coupled. Typical 100 W differential input impedance. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. MSA defines maximum current at 300 mA.
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Technical Data
5)
6) 7) 8)
9)
Internally AC coupled. Load 50 W to GND or 100 W differential. For dynamic measurement a tolerance of 50 mV should be added. Fibre Channel PI Standard. Measured values are 20% - 80%. Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter network (Figure 6) in place. A change in sensitivity of less than 1 dB can be typically expected. Supply current excluding Rx output load.
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Technical Data Optical Characteristics Parameter Transmitter Optical Modulation Amplitude 1) Launched Power (Average)2) Extinction Ratio (Dynamic)3) Center Wavelength1) Spectral Width (rms)
1)
Symbol min. OMA 620 -4 9 1300
Limit Values typ. max.
Unit
W 0 1320 1 -120 t.b.d. t.b.d. 80 t.b.d. t.b.d. 15 0 -21 -21 -21 dBm dB nm nm dB/Hz dBm ps ps ps ps W dBm dBm
PO
ER
lC sI
RIN DDJTx TJTx
Relative Intensity Noise Data Deterministic Jitter Total Jitter Rise Time4) Fall Time4) Receiver5) Min. Optical Modulation Amplitude 6) Average Received Power Sensitivity (Average Power)7) @ 2.125 Gbit/s @ 1.25 Gbit/s @ 1.0625 Gbit/s LOS Assert Level 8) LOS Deassert Level LOS Hysteresis Input Center Wavelength Optical Return Loss Data Deterministic Jitter Total Jitter
1) 2) 3) 4)
Tx Disable Laser Output Power PO-TxDis
tR-Tx tF-Tx
OMA
PR PIN
9)
PLOSA PLOSD PLOSA
-PLOSD
-37 -22 0.5 1260 12 t.b.d. t.b.d. 1 6 1580
dBm dBm dB nm dB ps ps
lC
ORL DDJRx TJRx
FC-PI Rev. 13 defines triple trade off curves. Into single mode fiber, 9 m diameter. For Gigabit Ethernet only. Measured at nominal data rate. These are unfiltered 20% - 80% values.
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Technical Data
5) 6) 7) 8)
9)
Receiver characteristics are measured with a worst case reference laser. Fibre Channel PI Standard. Average optical power at which the BER is 1x10-12. Measured with a 27-1 NRZ PRBS and ER = 9 dB. An increase in optical power above the specified level will cause the LOS output to switch from a high state to a low state. A decrease in optical power below the specified level will cause the LOS to change from a low state to a high state.
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Technical Data I/O Timing of Soft Control and Status Functions Parameter Tx Disable assert time Symbol t_off Max. Value 100 Unit ms Condition Time from Tx Disable bit set1) until optical output falls below 10% of nominal Time from Tx Disable bit cleared until optical output rises above 90% of nominal Time from power on or negation of Tx Fault using Tx Disable until transmitter output is stable2) Time from fault to Tx Fault bit set Time from LOS state to Rx LOS bit set Time from non-LOS state to Rx LOS bit cleared Time from change of state of Rate Select bit1) until receiver bandwidth is in conformance with appropriate specification N/A From power on to data ready, bit 0 of byte 110 set Time from power on until module is ready for data transmission
Tx Disable deassert t_on time Time to initialize, including reset of Tx Fault t_init
100
ms
300
ms
Tx Fault assert time t_fault LOS assert time LOS deassert time Rate select change time t_loss_on t_loss_off t_rate_sel
100 100 100 100
ms ms ms ms
Serial ID clock rate3) f_serial_clock Analog parameter data ready t_data
400 1000 300
kHz ms ms
Serial bus hardware t_serial ready
1) 2) 3)
Measured from falling clock edge after stop bit of write transaction. See Gigabit Interface Converter (GBIC). SFF-0053, Rev. 5.5, September 27, 2000. The maximum clock rate of the serial interface is defined by the I2C bus interface standard.
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Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Total Output Power (as defined by IEC: 7 mm aperture at 14 mm distance) Total Output Power (as defined by FDA: 7 mm aperture at 20 cm distance) Beam Divergence 1300 nm < 2 mW < 195 W 6
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 1401
Figure 3
Required Labels
Indication of laser aperture and beam
20 Tx
Top view
Rx 11
File: 1333
Figure 4
Laser Emission
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Application Notes Application Notes EMI Recommendations To avoid electromagnetic radiation exceeding the required limits set by the standards, please take note of the following recommendations. When Gigabit switching components are found on a PCB (e.g. multiplexer, serializerdeserializer, clock data recovery, etc.), any opening of the chassis may leak radiation; this may also occur at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as feasible and its length carefully considered. On the board itself, every data connection should be an impedance matched line (e.g. strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed symmetrically. Vias should be avoided. Where internal termination inside an IC or a transceiver is not present, a line terminating resistor must be provided. The decision of how best to establish a ground depends on many boundary conditions. This decision may turn out to be critical for achieving lowest EMI performance. At RF frequencies the ground plane will always carry some amount of RF noise. Thus the ground and VCC planes are often major radiators inside an enclosure. As a general rule, for small systems such as PCI cards placed inside poorly shielded enclosures, the common ground scheme has often proven to be most effective in reducing RF emissions. In a common ground scheme, the PCI card becomes more equipotential with the chassis ground. As a result, the overall radiation will decrease. In a common ground scheme, it is strongly recommended to provide a proper contact between signal ground and chassis ground at every location where possible. This concept is designed to avoid hotspots which are places of highest radiation, caused when only a few connections between chassis and signal grounds exist. Compensation currents would concentrate at these connections, causing radiation. However, as signal ground may be the main cause for parasitic radiation, connecting chassis ground and signal ground at the wrong place may result in enhanced RF emissions. For example, connecting chassis ground and signal ground at a front panel/ bezel/chassis by means of a fiber optic transceiver/cage may result in a large amount of radiation especially where combined with an inadequate number of grounding points between signal ground and chassis ground. Thus the transceiver becomes a single contact point increasing radiation emissions. Even a capacitive coupling between signal ground and chassis ground may be harmful if it is too close to an opening or an aperture. For a number of systems, enforcing a strict separation of signal ground from chassis ground may be advantageous, providing the housing does not present any slots or other discontinuities. This separate ground concept seems to be more suitable in large systems where appropriate shielding measures have also been implemented. The return path of RF current must also be considered. Thus a split ground plane between Tx and Rx paths may result in severe EMI problems.
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Application Notes The bezel opening for a transceiver should be sized so that all contact springs of the transceiver cage make good electrical contact with the face plate. Please consider that the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. Thus even the smallest PCBs may have unexpected resonances. Large systems can have many openings in the front panel for SFP transceivers. In typical applications, not all of these ports will hold transceivers; some may be intentionally left empty. These empty slots can emit significant amounts of radiation. Thus it is strongly recommended that empty ports be plugged with an EMI plug as shown in Figure 5. Infineon offers an EMI/dust plug, P/N V23818-S5-B1. Infineon Proposes Cage: Infineon Technologies Part Number: V23838-S5-N1 Cage EMI/Dust Plug: Infineon Technologies Part Number: V23818-S5-B1 Host Board Connector: Tyco Electronics Part Number: 1367073-1
CAGE EMI/DUST PLUG
DUST/PROCESS PLUG
File: 1510, 1511, 1512
Figure 5
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Application Notes EEPROM Serial ID Memory Contents (A0h) The data can be read using the 2-wire serial CMOS E2PROM protocol of the Atmel AT24C01A or equivalent.
Addr. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
1) 2) 3) 4) 5) 6) 7)
Hex 03 04 07 00 00 00 02 80 10 01 05 01 15 00 23 AA 1E 0F 00 00 49 6E 66 69 6E 65 6F 6E 20 41 47 20
ASCII
I n f i n e o n A G
Addr. 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 1)
Hex 20 20 20 20 00 00 03 19 56 32 33 38 34 38 2D 4D 31 35 2D 43 37 35 36 20 30 31 2E 30 05 1E 00
ASCII
V 2 3 8 4 8 M 1 5 C 7 5 6 02) 12) . 02)
Addr. 64 65 66 67 68 3) 69 3) 70 3) 71 3) 72 3) 73 3) 74 3) 75 3) 76 3) 77 3) 78 3) 79 3) 80 3) 81 3) 82 3) 83 3) 84 4) 85 4) 86 4) 874) 884) 89 4) 904) 91 4) 925) 936) 94 95 7)
Hex 00 1A 00 32
ASCII
68 B0 01
Addr. 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127
Hex 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20
ASCII
Address 63 is check sum of bytes 0 - 62. Version number will vary depending on product status. Address 68 - 83 Vendor Serial Number. Date code. Diagnostic Monitoring Type, if and how implemented. Enhanced Options, if any implemented. Address 95 is check sum of bytes 64 - 94.
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Application Notes Digital Diagnostic Monitoring Interface - Intelligent Alarm and Warning Thresholds (2-Wire Address A2h) Address 00 - 01 02 - 03 04 - 05 06 - 07 08 - 09 10 - 11 12 - 13 14 - 15 16 - 17 18 - 19 20 - 21 22 - 23 24 - 25 26 - 27 28 - 29 30 - 31 32 - 33 34 - 35 36 - 37 38 - 39 40 - 55
1)
# Bytes 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 16
Name Temp High Alarm Temp Low Alarm Temp High Warning Temp Low Warning Voltage High Alarm Voltage Low Alarm Voltage High Warning Voltage Low Warning Bias High Alarm Bias Low Alarm Bias High Warning Bias Low Warning Tx Power High Alarm Tx Power Low Alarm Tx Power High Warning Tx Power Low Warning Rx Power High Alarm Rx Power Low Alarm Rx Power High Warning Rx Power Low Warning Reserved
Description MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address Reserved for future monitored quantities
Value 90C1) -30C 85C1) -20C 3.7 V 2.95 V 3.63 V 2.97 V t.b.d. t.b.d. t.b.d. t.b.d. 1 dBm -5 dBm 0 dBm -4 dBm 1 dBm -22 dBm 0 dBm -21 dBm
A delta exists between actual transceiver temperature and value shown as measurement is taken internal to an IC located on the underside of the iSFP PCB.
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Application Notes Alarm and Warning Flags (2-Wire Address A2h) Byte 112 112 112 112 112 112 112 112 113 113 113 113 113 113 113 113 114 115 116 116 116 Bit 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 All All 7 6 5 Name Temp High Alarm Temp Low Alarm VCC High Alarm VCC Low Alarm Tx Bias High Alarm Tx Bias Low Alarm Tx Power High Alarm Tx Power Low Alarm Rx Power High Alarm Rx Power Low Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Reserved Temp High Warning Temp Low Warning VCC High Warning Set when internal temperature exceeds high warning level Set when internal temperature is below low warning level Set when internal supply voltage exceeds high warning level
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Description Set when internal temperature exceeds high alarm level Set when internal temperature is below low alarm level Set when internal supply voltage exceeds high alarm level Set when internal supply voltage is below low alarm level Set when Tx Bias current exceeds high alarm level Set when Tx Bias current is below low alarm level Set when Tx output power exceeds high alarm level Set when Tx output power is below low alarm level Set when received power exceeds high alarm level Set when received power is below low alarm level
Preliminary Product Information
V23848-M15-C756
Application Notes Alarm and Warning Flags (2-Wire Address A2h) (cont'd) Byte 116 116 116 116 116 117 117 117 117 117 117 117 117 118 119 Bit 4 3 2 1 0 7 6 5 4 3 2 1 0 All All Name VCC Low Warning Tx Bias High Warning Tx Bias Low Warning Tx Power High Warning Tx Power Low Warning Rx Power High Warning Rx Power Low Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Reserved Description Set when internal supply voltage is below low warning level Set when Tx bias current exceeds high warning level Set when Tx bias current is below low warning level Set when Tx output power exceeds high warning level Set when Tx output power is below low warning level Set when received power exceeds high warning level Set when received power is below low warning level
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Application Notes A/D Values and Status Bits (2-Wire Address A2h) Byte 96 97 98 99 100 101 102 103 104 105 106 107 108 109
1)
Bit All All All All All All All All All All All All All All
Name Temperature MSB Temperature LSB VCC MSB VCC LSB Tx Bias MSB Tx Bias LSB Tx Power MSB Tx Power LSB Rx Power MSB Rx Power LSB Reserved MSB Reserved LSB Reserved MSB Reserved LSB
Description Internally measured module temperature1) Internally measured supply voltage in transceiver2) Internally measured Tx Bias Current3) Measured Tx output power4) Measured Rx input power5) Reserved for 1st future definition of digitized analog input Reserved for 1st future definition of digitized analog input Reserved for 2nd future definition of digitized analog input Reserved for 2nd future definition of digitized analog input
Converted analog values. Calibrated 16 bit data.
2) 3) 4) 5)
Temperature measurement is performed on an IC located on the underside of the iSFP PCB. The accuracy is 3C. The Tx voltage VCCT is monitored, with accuracy of 3%. The accuracy of bias current measurement is 10%. The accuracy of the Tx optical power measurement is 1 dB. The accuracy of the Rx optical power measurement is 3 dB.
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Application Notes Single Mode 1300 nm iSFP Transceiver, AC/AC TTL
1 H
VCCT
0.1 F
VEET
xx nF 1)
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Short trace lengths are mandatory.
3.3 V
1 H
VCCR
xx nF 1) 0.1 F 10 F 0.1 F 10 F
VEER
iSFP Module
Host Board
File: 1304
Figure 6
Recommended Host Board Supply Filtering Network
3.3 V
1 H
Infineon iSFP Transceiver
16
xx nF 1) 0.1 F
Protocol VCC Protocol VCC
4.7 to 10 k
10 F
0.1 F
1 H
VCCT 17
4.7 to 10 k
Tx Disable Tx Fault
Tx Disable Tx Fault TD-
0.01 F
100
Laser Driver
TD+ VEET 15
0.01 F
Protocol IC
SerDes IC
4.7 to 10 k
xx nF 1) 10 F 0.1 F
VCCR 14
RD+
100
0.01 F
RD- LOS 3.3 V VEER
4.7 to 10 k 4.7 to 10 k 4.7 to 10 k
0.01 F
Preamp & Quantizer
LOS
PLD / PAL
MOD-DEF(0)
MOD-DEF(1)
MOD-DEF(2)
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Short trace lengths are mandatory.
File: 1303
Figure 7
Example iSFP Host Board Schematic
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V23848-M15-C756
Package Outlines Package Outlines
Dimensions in mm
File: 1215
Figure 8
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V23848-M15-C756 Revision History: Previous Version: Page 2003-04-09 2003-04-09 DS0
Subjects (major changes since last revision)
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2003-04-09 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany
(c) Infineon Technologies AG 2003.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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